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FPC
Current Position: Products > FPC    

 

Product Structure

Application
 

★ Cell Phone
★ DSC & DV
★ PC
★ Pick Up
★ LCD Module
★ Camera Module
★ Backlight
★ Auto Electronic
★ Industrial Fields etc.

Equipments

Process Capability
 

Spec&Technical Parameter

Normal

Special

Surface Treatment

Normal (μm)

Layer 1~7   Tin plating 5~30
Minimume Circuit Width And Speace 0.075 mm 0.05 mm ENIG Ni:1.0~6.0 ; Au:0.03~0.10
PTH(Drill / Pad) 0.2/0.5 mm 0.15/0.35 mm Electro "Ni/Au" plating <soft> Ni:3~12 ; Au:0.03~0.80
Coverlay Misalignment Tolerance ±0.3mm(±0.2mm for circuit) ±0.2mm(±0.1mm for circuit) Electro "Ni/Au" plating<hard> Ni:3~12 ;Au:0.10~0.80
Photo-image Solder Resistance Misalignment Tolerance ±0.10mm for circuit ±0.05mm for circuit Electro "Au" plating 0.20~0.80
Outline Tolerance ±0.1mm ±0.05mm O.S.P. 0.20~0.50
Min Chip Size for SMT 0402 0201    
Rigid Flex 4 layers 6 layers    
Blind via 0.1 mm 0.075 mm    


Main Customers

Achievement

E-mail: BYDCPTG@BYD.COM
Tel: +86-755-89888888 转69395
 

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